Seed Layers Technology LLC is a subsidiary of, and is managed by, General Patent Corporation (GPC).

GPC provides enforcement services for Seed Layers' portfolio of patents related to methods for electroplating metals or alloys (copper or silver) for filling high aspect ratio (ratio between vertical and lateral dimensions) trenches in semiconductor fabrication.

This website provides information about the Seed Layers patents, plus news about the patent enforcement campaign.

For more information about Seed Layers Technology, please see our About Us page.