The patent portfolio of Seed Layer Technology (SLT) consists of 10 U.S. patents with [369] issued claims and three pending applications, all of which relate to methods for electroplating metals or alloys (copper or silver) for filling high aspect ratio (ratio between vertical and lateral dimensions) trenches in semiconductor fabrication.

Seed Layers is a subsidiary of, and is managed by, General Patent Corporation, which offers patent enforcement on a contingency basis.